Based on our patented innovative technology, HARDSIL®, VORAGO designs and develops semiconductor solutions with superior radiation and temperature endurance performance. Based on HARDSIL® we also provide our customers and partners with the option to choose from a variety of specialized services from ASIC design, custom packaging to board designs.
VORAGO's patented, innovative technology, HARDSIL®, has been proven in multiple process generations at multiple fabs to harden semiconductor circuits without redesign and is scalable to any generation node (incl.FinFET). Once modified by HARDSIL®, the commercial process flow can be used to manufacture significantly more robust circuits for highly reliable operation in extreme environments. This capability dramatically enhances the hardness and reliability of semiconductor devices and provides a disruptive alternative to current hi-rel approaches utilizing up-screened COTS, redundant systems, exotic packaging, special design techniques or expensive specialized low volume processes.
Incorporating the patented HARDSIL® technology into their own designs and several Texas Instruments products spanning multiple process generations, VORAGO has successfully demonstrated superior hardening in a number of devices including high density SRAMs, DSPs and AMS parts. Because the technology is applied at the process-level, no performance, power or circuit size trade-offs are required. As a result, hardened semiconductor components for extreme environments are now within reach for system designers; a solution with the highest performance in reduced form factors while using much less power.
Partnering with Texas Instruments, VORAGO Technologies introduced its first product, a QML-V, space-qualified rad hard 16Mb SRAM, during 2012. This product is the only rad-hard SRAM offering to combine superior radiation hardening with no trade-offs in performance.
Now also partnering with GLOBALFOUNDRIES, TSMC and others VORAGO is developing new products incorporating HARDSIL® to provide an expanding product portfolio for extreme environment electronic applications.
